The first issue 2017 in Advanced Materials Interfaces highlights “Perspectives in Interface Research”.
Manufacturing
Application of Superconductor Technology
Festo presents two innovative application concepts for superconductor technology.
The Sound of Smallness
Researchers from the Massachusetts Institute of Technology, USA have introduced a simple strategy for making nanoparticles by the sonofragmentation of high‐aspect‐ratio 1D substrates.
Melt-Processed Semiconducting Polymer Blends for Flexible Devices
A collaborative team of researchers at Purdue University and the University of California Santa Cruz have reported a strategy that overcomes the issue of solvent by employing a melt-processing technique.
Deformation-Induced Supersaturation During High-Pressure Torsion
Bulk nanostructured materials have been the subject of extensive research over the past couple of decades due to their extraordinary mechanical and functional properties.
BASF launches new Ucrete
BASF introduce an antistatic industrial flooring system to the European market
The Missing Link: 3D Bioprinting with Non-Viscous Inks
Jason Burdick and colleagues from the University of Pennsylvania, USA, and Tsinghua University, China report a general method for 3D bioprinting of photocrosslinkable hydrogels without limitations on ink viscosity.
Nano- and Micro-Mechanical Properties of Ultrafine-Grained Materials
This review summarizes the available experimental results showing enhancements in strength and ductility in a range of UFG metals after several different SPD processing procedures.
Making 2D Barcodes Work Harder for Anticounterfeit Technology
Researchers from the University of British Columbia, Vancouver, believe that 2D barcodes can be made to work harder by fully exploiting the 3D information they actually contain.
Hot Stuff: Direct Ink Writing of Mesoscale Eutectic Architectures
Jennifer Lewis and colleagues report a new process for creating mesoscale eutectic architectures, known as high operating temperature direct ink writing (HOT‐DIW).
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