Findings and resulting theory could reveal mechanism behind zero-energy-loss current-carrying capability.
Electronics
Dow Corning now a member of imec
Company will cooperate with imec to fabricate 3D integrated nanoelectronics.
Making semiconducting graphene for advanced electronics
Cornell researchers show that imperfect graphene sheets can display “electrical highways”.
CEA-Leti and EV group will jointly research wafer bonding technologies
Projects target more efficient 3D TSV integration and covalent bonding at room temperature.
Nanostructuring quartz glass leads to 5D optical memory
Scientists have, for the first time, experimentally demonstrated the recording and retrieval processes of 5D digital data by femtosecond laser writing.
Alchimer collaborate with CEA-Leti on TSV applications
Project will evaluate and implement Alchimer’s wet deposition processes for 300mm high-volume manufacturing.
Ascent Solar agree joint venture with Suqian government
Agreement covers a multi-faceted, three-phase project over the next six years for producing CIGS technology.
MIT microchip survives radiation of a trip to Mars
DNA-sequencing microchip functions after exposure to radiation doses similar to those that might be expected during a robotic expedition to Mars.
Silicon oxide memory overcomes crosstalk hurdle
Embedded diodes boost Rice University invention’s potential as robust, roomy memory.
Room temperature liquid metal structures- free article access
Researchers have developed three-dimensional printing technology and techniques to create free-standing structures made of liquid metal at room temperature.
Popular
-
New theory suggests gravity is not a fundamental force
-
Water-powered gadgets may be on the horizon thanks to new evaporation-based energy device
-
Micron-sized hidden dimensions could solve two of physics’ deepest puzzles
-
Turning Periods into Power: Menstrual Blood a Valuable Resource for Medical Diagnostics
-
Organic materials bring probabilistic computing closer to reality
-
Kirigami-inspired neural probes are a cut above