The issue aims to provide a representative and comprehensive overview on the broad range of current biophotonics on-chip, spanning the full range from chip fabrication to applications in biomedical sensing and related fields.
Month: September 2012
Advanced Optical Materials Issue 3
Issue 3 of Advanced Optical Materials covers optical waveguides, plasmonics, nanolasers, and more. All articles are free to read.
Fiber-Coupled Module with Increased Brightness
Conduction-cooled fiber-coupled diode laser module based on diode laser bars which delivers 32 Watt at a wavelength of 793 nm from a 105-micron fiber core with a numerical aperture (NA) of <0.22.
Alignment, Assembly, and Final Inspection of Microlithography Optics
Measurement system “OptiCentric Max UP” for the ultra accurate measurement of centration error, lens center thickness and air spacing of optical components for microlithography.
Scan-Macroscope for the Quality Control of Medical Implants
New Scan-Macroscope with integrated bright-field illumination and telecentric lens for the automated quality control of the geometry and texture of stents.
Polarization Analyzer for Fiber Optic and Free Beam Application
“SK010PA” series polarization analyzer, a comprehensive universal measurement and test system for free beam applications and fiber-coupled laser sources.
Polyesters from Rapeseed Oil
Researchers in Karlsruhe used plant oils to synthesize renewable long-chain aliphatic polyesters using olefin self-metathesis for the monomer synthesis.
Core-shell particles for acoustic metamaterials by millifluidics
Wunenburger and coworkers at the University of Bordeaux and the CNRS have used millifluidics to create hard core-soft shell microparticles.
Enhancing fertility by microfluidics and biophotonics
Lab-on-a-chip method, when combined with biophotonics, can be used to assay for metabolites, to separate gametes via optoelectrical tweezers, or to improve the vitrification of oocytes.
Plastics Become Heat Conductors by Lamellar Crystal Alignment
Thermally conductive thermoplastics have attracted attention as heat dissipative materials for a vast number of electronic devices. S. Yoshihara and coworkers (Kaneka Corporation, Japan) now report that thermoplastics exhibit high thermal conductivity by lamellar crystal alignment.
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