Rolith has announced that it has received an exclusive license to methods of micro and nano-patterning substrates to make transparent conductive electrodes.
Dow Announces Completion of 30 KTA Liquid Epoxy Resin Expansion at Stade Site
Dow Epoxy has completed its 30 KTA Liquid Epoxy Resin (LER) expansion at its fully back-integrated Stade, Germany site.
IEDM 2012: imec Addresses Key Challenges of Scaling beyond Silicon-Channel finFETs
At the recent IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs.
Tough tests for next generation ceramics
Berkeley Lab researchers develop real-time CT-scan test rig for ceramic composites at ultrahigh temperatures.
Nanotechnology Company Liquipel Announces New Technology and Branding Licenses
Electronics coating firm expands business in Turkey, Qatar, the United Arab Emirates and Saudi Arabia.
Thermoplastic composites made simpler to produce
Researchers develop method that allows the series production of continuous fiber-reinforced thermoplastic composites with an injection molding process.
Copper, gold and tin for efficient chips
New galvanisation process from Fraunhofer Institute for Microelectronic Circuits and Systems IMS offers promise of better LEDs.
Asia-Pacific Biorenewable Materials Market Estimated to Grow at 19% per Annum till 2018
Application development and technology licensing costs of biorenewables come down, and customer awareness is growing.
Dow Completes Roof-Top Solar System Installation at Polyolefin Encapsulant Films Plant
Dow installs a high-efficiency solar system at polyolefin plant in Map Ta Phut, Thailand.
Olympus NDT Introduces the Magna-Mike 8600 Hall Effect Thickness Gauge
New instrument is a portable thickness gauge for making thickness measurements on nonferrous materials.