To move technology from the bench to the real-world, there must be a balance between functionality and scalability.
Towards full-control of microstructures in additive manufacturing.
New material is environmentally responsible, cost-effective, soy-based and free of N-methyl-2-pyrrolidone (NMP) solvent.
Rolith has announced that it has received an exclusive license to methods of micro and nano-patterning substrates to make transparent conductive electrodes.
Dow Epoxy has completed its 30 KTA Liquid Epoxy Resin (LER) expansion at its fully back-integrated Stade, Germany site.
At the recent IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel finFETs.
Berkeley Lab researchers develop real-time CT-scan test rig for ceramic composites at ultrahigh temperatures.
Electronics coating firm expands business in Turkey, Qatar, the United Arab Emirates and Saudi Arabia.
Researchers develop method that allows the series production of continuous fiber-reinforced thermoplastic composites with an injection molding process.
New galvanisation process from Fraunhofer Institute for Microelectronic Circuits and Systems IMS offers promise of better LEDs.
Application development and technology licensing costs of biorenewables come down, and customer awareness is growing.
Dow installs a high-efficiency solar system at polyolefin plant in Map Ta Phut, Thailand.