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Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include: * Alloy development * Composite approaches (including nanoscale reinforcements) * Thermomechanical fatigue * Electromigration * Whisker growth * Reliability under impact loading * Accelerated thermal cycling * Long-term reliability * High temperature lead-free solders Lead-free Solders: Materials Reliability for Electronics: Representing a major resource in material design for microelectronics development and manufacturing this is essential reading for Researchers in materials science and electronic/electrical engineering in both academia and industry, as well as graduate students in these fields. Physicists and chemists involved in lead-free electronics will also find this of interest. [520 Pages, Hardcover] |
New Book Series “Nanotechnology Innovation and Applications”
New book series “Nanotechnology Innovation and Applications” – out now! The book series “Nanotechnology Innovation and Applications” was initiated and overseen by Prof. Dr. Dr. h.c. Marcel Van de Voorde who has more than 40 years’ experience in European research...
