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Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips. [606 Pages, Hardcover] |
New Book Series “Nanotechnology Innovation and Applications”
New book series “Nanotechnology Innovation and Applications” – out now! The book series “Nanotechnology Innovation and Applications” was initiated and overseen by Prof. Dr. Dr. h.c. Marcel Van de Voorde who has more than 40 years’ experience in European research...
