Lead-free Solders

by | Mar 26, 2012

  Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include: * Alloy development * Composite approaches (including nanoscale reinforcements) * Thermomechanical fatigue * Electromigration * Whisker growth * Reliability under impact loading * […]
  Lead-free Solders: Materials Reliability for Electronics provides a comprehensive understanding of the current state of lead-free electronic interconnects research from fundamental, applied, and manufacturing perspectives. The main thematic areas addressed include:
* Alloy development
* Composite approaches (including nanoscale reinforcements)
* Thermomechanical fatigue
* Electromigration
* Whisker growth
* Reliability under impact loading
* Accelerated thermal cycling
* Long-term reliability
* High temperature lead-free solders

Lead-free Solders: Materials Reliability for Electronics:
* Provides a comprehensive review of the current state of knowledge for implementing lead-free electronics required under recent legislation
* Includes articles on alloy development, electromigration and long-term reliability
* Contains contributions from academic, industrial and national laboratory researchers

Representing a major resource in material design for microelectronics development and manufacturing this is essential reading for Researchers in materials science and electronic/electrical engineering in both academia and industry, as well as graduate students in these fields. Physicists and chemists involved in lead-free electronics will also find this of interest. [520 Pages, Hardcover]

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